It is reported that Huawei Investment Holding Co., Ltd. (hereinafter referred to as Huawei) recently submitted the registration materials for the first/second period MTN of the year 2019 which is currently in the process of "pre-assessment ".
Previously, Huawei had only issued four dollar bonds and two dim sum bonds overseas, and had no experience of issuing bonds in China. This will be the first time that Huawei raise funds in the domestic bond market. The lead underwriter of the first period is ICBC, and that of the second period is CCB. The issuing scale of Huawei's largest registrable MTN is 30 billion yuan.
According to the prospectus, the issuing scales of Huawei's first and second period MTN are both 3 billion yuan, which will be used to supplement the operating capital of the HQ and its subsidiaries.