Yesterday, MediaTek released its 5G Mobile Platform "Dimensity" and its first 5G SoC which is named “Dimensity 1000” in Shenzhen.

Dimensity is one of the seven stars of the Big Dipper, which means to guide the direction and represents MediaTek’s vision to develop world-leading products.

According to MediaTek, Dimensity 1000 is the first 5G SoC in the industry which offers two solutions of carrier aggregation with a downlink throughput up to 4.7Gbps and an uplink throughput up to 2.5Gbps; Meanwhile, it is also the first 5G chip which supports 5G + 5G dual card dual standby. Comparatively speaking, Dimensity 1000 of MediaTek presents a better baseband capacity than products of other 5G chip providers such as Qualcomm and HiSilicon.

In addition, Dimensity 1000 also supports WiFi 6, which is claimed to be the fastest in the industry with a throughput exceeding 1000Mbps.

According to AnTuTu Benchmark, the performance of Dimensity 1000 scored over 510,000, which is higher than that of Qualcomm Snapdragon 855 Plus and HiSilicon Kirin 990 5G, making it top the performance list in the industry.