On May 25, at the 2026 International Symposium on Circuits and Systems (Shanghai), He Tingbo, Director of Huawei and President of its Semiconductor Business Unit, officially announced the "Tao (τ) Law." This marks the first time China has proposed a new principle to guide industrial development in the global semiconductor field.
According to the announcement, the "Tao Law" replaces "geometric scaling" with "temporal scaling." By employing techniques such as logic folding to compress signal propagation delays, it systematically reduces the time constant (τ), thereby increasing transistor density and overall system performance. This approach has already supported Huawei in mass-producing 381 chip models over the past six years.
He Tingbo revealed that this autumn, Huawei will launch a new Kirin mobile phone chip that fully integrates logic folding technology. It is projected that by 2031, high-end chips based on the "Tao Law" will achieve transistor density equivalent to the 1.4nm process node.
As Moore's Law approaches physical and economic limits, the "Tao Law" establishes a multi-level, collaborative optimization system spanning devices, circuits, chips, and systems. He Tingbo emphasized, "The future must belong to open cooperation," calling on the global industry to jointly advance the continued evolution of semiconductors.